VASC Seminar Announcement
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Date: Tuesday, 7/17/01
Time: 3:30-4:40
Place: NSH 3002

Speaker: Dr. Tosh Honda, Hitachi
Title: Automated Visual Inspection for Solder Joints of PCB based on 3-D Image Analysis

Automated Visual Inspection system based on 3D image analysis.  The
optical range scanner accurately detects height of solder joint from
differently focused laser spot. Emitted laser light on the solder
joint is detected simultaneously by plural sensors whose focal points
are set at different height to realize high speed height acquisition
without secondary reflection problems caused by the specular surface
of the solder joint.  An inspecton algorithm was designed to recognize
a solder joint using detected height and the intensity image so that
different shapes of solder fillet do not affect inspection
performance.  Inspection parameters are automatically generated using
electronic component and PCB design data. Evaluation showed the system
gave 100% detect defection and very few false alarms (0.13%) using
autogenerated inspection parameters.